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ISO 9001:2015 Certified Facility

Precision glass machining

cleantechconseil.com

Machining Glass makes precision glass and quartz components to print — wafers, microfluidic chips, optical filters, windows, conductive glass and more. Send a drawing and we handle machining, coating, bonding and inspection.

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Core product frameworks

Interactive Configuration Modules

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[01.A]
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AR & Optical Windows

AR-coated and uncoated windows for UV, visible and infrared paths, with controlled flatness and parallelism.

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[02.B]
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Beam Splitters

Plate and dichroic beam splitters for laser and imaging systems, coated to your split ratio.

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[03.C]
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CCD Cover Glass

Cover and carrier glass for CCD/CMOS sensor screening and imaging equipment.

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[04.D]
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Custom Glass

Made-to-print quartz and specialty glass — thin discs, sheets and non-standard geometries.

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[05.E]
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Glass & Quartz Wafers

Fused silica, quartz and borosilicate wafers from 2 to 12 inches, diced, ground and cleaned for…

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[06.F]
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Glass-Bottom Microplates

Glass-bottom microplates for high-content screening and high-resolution imaging.

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[07.G]
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ITO / FTO Conductive Glass

ITO and FTO coated glass with specified sheet resistance for displays, touch sensors and electrochemistry.

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[08.H]
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LED / OLED Cover Glass

Etched and grooved cover glass for LED and OLED module packaging and encapsulation.

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[09.I]
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Microfluidic Chips

Etched and bonded glass chips with sealed channels for diagnostics, cell analysis and lab-on-chip instruments.

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[10.J]
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Optical Filters

Coated optical glass filters — longpass, shortpass, bandpass, notch, dichroic and neutral density — cut to…

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[11.K]
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Perforated & Shaped Plates

Drilled, slotted and profiled glass and quartz plates held to tight positional tolerances.

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Advanced tooling

Engineering Capabilities

01

CNC Ultrasonic Machining

Milling, drilling, slotting and contouring of brittle glass and quartz.

02

Femtosecond Laser Ablation

Cold ablation for microchannels, vias and internal features without micro-cracking.

03

Optical Polishing

Flatness, roughness and parallelism control for optical-grade surfaces.

04

Precision Dicing & Cutting

Wafer dicing and profile cutting with clean edges and tight kerf control.

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Substrates

Materials We Machine

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Catalogue

Featured Products

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Workflow

From Concept to Certification

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1. Submission

Upload STEP / DXF drawings for structural review.

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2. DFM Review

Engineering review of tolerances and material compatibility.

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3. Production

CNC / laser machining in a cleanroom-controlled environment.

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4. Verification

Final metrology reporting and ISO compliance documentation.

Engineering FAQ

What is the minimum feature size for laser-etched glass? expand_more
Using femtosecond laser technology we reach feature sizes down to 10 microns, with aspect ratios up to 1:50 depending on substrate thickness and material.
Do you support microfluidic channel bonding? expand_more
Yes — thermal bonding for fused silica and UV-adhesive bonding for multi-layer assemblies, giving hermetic seals for high-pressure applications.
What tolerances can be expected on CNC-ground edges? expand_more
Standard tolerances are ±0.05 mm. For critical work we grind to ±0.005 mm with laser-interferometer verification.

Engineering Review

Ready to precision-engineer your glass components?

Send drawings, tolerances and material notes. We review geometry, material and feasibility, then quote prototype or production quantities.

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