What we do

Capabilities

Laser ablation, CNC machining, dicing, bonding, polishing and coating.

Capability

Anti-reflection and transparent conductive coatings to your specification.

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Capability

Flatness, roughness and parallelism control for optical-grade surfaces.

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Capability

Sealed glass-to-glass and glass-to-silicon bonding for chips and assemblies.

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Capability

Wafer dicing and profile cutting with clean edges and tight kerf control.

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Capability

Milling, drilling, slotting and contouring of brittle glass and quartz.

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Capability

Cold ablation for microchannels, vias and internal features without micro-cracking.

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Engineering Review

Have a project in mind?

Send your requirements and we will match the right material, process and finish.

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