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SKU MG-WF-02

4-inch Borofloat 33 Glass Wafers

Borosilicate wafers with low thermal expansion for MEMS and sensor processing.

Borofloat 33Material
100 mmDiameter
0.5–1.0 mmThickness
3.25 ppm/KCTE
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Borosilicate wafers with low thermal expansion for MEMS and sensor processing.

Specifications

Material Borofloat 33
Diameter 100 mm
Thickness 0.5–1.0 mm
CTE 3.25 ppm/K
PRECISION GLASS 3D
3D Precision Glass Configurator Build a visual 3D preview for custom precision glass parts, including wafers, microfluidic chips, coated glass, optical filters, and machined quartz plates. This tool is for visual configuration only. Final dimensions, tolerances, materials, coatings, and manufacturability will be reviewed from your drawing or specification.
3D GLASS PREVIEW Visual Specification

Glass Wafer Builder

Interactive visual preview for custom precision glass configuration.

SP SPEC SUMMARY:

SUBMIT RFQ — ENGINEERING REVIEW Your current 3D configuration and specification summary are attached automatically. Attach a drawing if you have one.
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FREQUENTLY ASKED QUESTIONS
Which fused silica grade should I choose — JGS1, JGS2 or JGS3?

JGS1 offers deep-UV transmission from about 185 nm (best for DUV lithography and UV laser optics). JGS2 transmits well from about 220 nm for standard UV-visible use at lower cost. JGS3 is optimized for visible-to-infrared and high-power laser work. The builder exposes a transmission-band requirement so you can specify the grade by application.

What wafer diameters and thicknesses are supported?

Common diameters are 2, 3, 4 and 6 inch (note 1 inch = 25.0 mm for quartz wafers, so a 4 inch wafer is 100 mm). Typical thicknesses are 200, 500, 700 and 1000 µm, with tighter thickness tolerance and TTV specifiable for polished optical grades.

Can I specify TTV, surface quality and a flat or notch?

Yes. You can set total thickness variation, scratch-dig surface quality (down to 40/20 or 20/10 for optical grade), single- or double-side polish, and a primary flat or notch for orientation.

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